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Index
HBM Memory Supercycle Index
official“An index of memory makers and equipment vendors leveraged to high-bandwidth memory (HBM) demand from AI accelerators — memory is the new bottleneck.” — by Leila Vargas
built · 2026-04-30 21:38·rebalance · quarterly·next run · 2026-07-30
backtest · S&P 500 (SPX)·range
CAGR—
Annual vol—
Sharpe—
Sortino—
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risk-free raterf = 4.50%
vs S&P 500 (SPX) · 1M—
vs S&P 500 (SPX) · 1Y—
vs S&P 500 (SPX) · 2Y—
vs S&P 500 (SPX) · 3Y—
vs S&P 500 (SPX) · 5Y—
vs S&P 500 (SPX) · 10Y—
no backtest data
sharpe ratio
| ticker | weight | YTD | 1Y | 3Y | 5Y | 10Y |
|---|---|---|---|---|---|---|
| MU | 25.0% | — | — | — | — | — |
| EWY | 20.0% | — | — | — | — | — |
| AMAT | 15.0% | — | — | — | — | — |
| LRCX | 12.0% | — | — | — | — | — |
| ASML | 10.0% | — | — | — | — | — |
| TOELY | 8.0% | — | — | — | — | — |
| ONTO | 6.0% | — | — | — | — | — |
| ACMR | 4.0% | — | — | — | — | — |
| weighted | 100% | — | — | — | — | — |
attribution factsheet
holdings · 8
click a row to drill in ↗NameAllocation· cap 25%Rationale
MUMicron TechnologyTechnology25.00%HBM3E ramp; sold out through 2026.EWYiShares MSCI South Korea ETFTechnology20.00%Largest memory maker globally returning to HBM leadership. (substituted via EWY — Samsung's US pink sheet is essentially untradeable)AMATApplied MaterialsTechnology15.00%TSV and hybrid bonding equipment for HBM stacking.LRCXLam ResearchTechnology12.00%Etch and deposition critical to HBM die manufacturing.ASMLASML HoldingTechnology10.00%EUV needed for next-generation DRAM nodes.TOELYTokyo ElectronTechnology8.00%Coater/developer and HBM advanced packaging equipment.ONTOOnto InnovationTechnology6.00%Inspection metrology for HBM yield.ACMRACM ResearchTechnology4.00%Wafer cleaning systems for advanced memory production.
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weighting · market_cap · cap=25%
rebalance · quarterly
